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Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

Shenzhen Jingxin Electronic Technology Co., Ltd.

High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ

Detailed Product Description Material: FR4 Board Thickness: 1.2mm Copper Thickness: 1OZ Feature 1: Gerber/PCB File Needed Feature 2: 100% E-test Feature 3: 2 Years Guarantee High Density Interconnect ...

Product Tags:

pcb printed circuit board assembly

      

pcb manufacturing and assembly

      
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